SEAMLESS MOLD MANUFACTURING METHOD

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United States of America Patent

APP PUB NO 20110027408A1
SERIAL NO

12864212

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A seamless mold manufacturing method of the invention is a seamless mold manufacturing method having the steps of forming a thermal reaction type resist layer on a sleeve-shaped mold, and exposing using a laser and developing the thermal reaction type resist layer and thereby forming a fine mold pattern, and is characterized in that the thermal reaction type resist layer is comprised of a thermal reaction type resist having a property of reacting in predetermined light intensity or more in a light intensity distribution in a spot diameter of the laser.

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Patent Owner(s)

Patent OwnerAddress
ASAHI KASEI E-MATERIALS CORPORATION1-105 KANDA JINBOCHO CHIYODA-KU TOKYO 101-8101

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Maeda, Masatoshi Tokyo, JP 31 534
Mitamura, Yoshimichi Tokyo, JP 13 106
Suzuki, Masaru Tokyo, JP 335 4302

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