ELECTRICALLY ISOLATED HEAT SINK FOR SOLID-STATE LIGHT

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United States of America Patent

APP PUB NO 20110026264A1
SERIAL NO

12846516

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An illumination device comprises a solid-state light source and a heat transfer structure. The solid-state light source is thermally conductively coupled to the heat transfer structure to dissipate heat thereby. The heat transfer structure includes a first thermally conductive element and a second thermally conductive element. The first thermally conductive element is configured to transfer at least a portion of the heat from the light source to an external ambient environment. The second thermally conductive element is electrically non-conductive and electrically isolates the first thermally conductive element from the light source.

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Patent Owner(s)

Patent OwnerAddress
EXPRESS IMAGING SYSTEMS LLC624 RAINIER AVENUE SOUTH SEATTLE WA 98144

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Reed, William G Seattle, US 79 3424
Renn, John O Lake Forest Park, US 13 751

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