Importance

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Abstract

Expungement ions, preferably including hydrogen ions, are implanted into a face of a first, preferably silicon, substrate such that there will be a maximum concentration of the expungement ions at a predetermined depth from the face. Subsequently a monocrystalline Group II-VI semiconductor layer, or two or more such layers, is/are grown on the face, as by means of molecular beam epitaxy. After this a second, preselected substrate is attached to an upper face of the Group II-VI layer(s). Next, the implanted expungement ions are used to expunge most of the first substrate from a remnant thereof, from the grown II-VI layer, and from the second substrate. In another embodiment, a group II-VI layer is grown on a first substrate silicon and an ionic implantation is conducted such that a maximum concentration of expungement ions occurs either in the silicon substrate at a predetermined depth from its interface with the II-VI layer or in the first Group II-VI semiconductor layer at a predetermined depth from the top face of the Group II-VI semiconductor layer. Thereafter all of the first substrate is expunged from the rest of the workpiece. Thin monocrystalline Group II-VI semiconductor structures may thus be mounted to substrates of the fabricator's choice; these substrates may be semiconductors, integrated circuits, MEMS structures, polymeric, metal or glass, may be flexible and may be curved.

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First Claim