INTEGRATED CIRCUIT PACKAGE
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United States of America Patent
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Issued Date -
Jan 27, 2011
app pub date -
Jul 22, 2010
filing date -
Jul 22, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An integrated circuit combination, comprising first and second integrated circuit dies with respective first and second control register banks, and a path for external control data, within said combination, coupling a first data interface on said first die, which receives the external control data, to the first and second control register banks.
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