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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
STMICROELECTRONICS (GRENOBLE 2) SAS	12 RUE JULES HOROWITZ GRENOBLE 38000

International Classification(s)

• H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
• B23K:SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLA....

• 2010 Application Filing Year
• H01L Class
• 16510 Applications Filed
• 13147 Patents Issued To-Date
• 79.64 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Coffy, Romain	Saint Martin Le Vinoux, FR	79	724
# of filed Patents : 79 Total Citations : 724
Quercia, Fabien	Echirolles, FR	19	9
# of filed Patents : 19 Total Citations : 9

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• H01L Class

• 0 % this patent is cited more than
• 14 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2011/0018,135

METHOD OF ELECTRICALLY CONNECTING A WIRE TO A PAD OF AN INTEGRATED CIRCUIT CHIP AND ELECTRONIC DEVICE

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Abstract

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A wire is electrically connected to an electrical bonding pad of an integrated circuit chip and electronic device through an intermediate electrical interconnect block that is interposed between the electrical bonding pad and one end of the electrical lead wire.

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Description

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