SEMICONDUCTOR CHIP PACKAGE STRUCTURE FOR ACHIEVING ELECTRICAL CONNECTION WITHOUT USING WIRE-BONDING PROCESS AND METHOD FOR MAKING THE SAME
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United States of America Patent
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Issued Date -
Jan 27, 2011
app pub date -
Dec 29, 2009
filing date -
Jul 24, 2009
priority date (Note) -
Abandoned
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Abstract
A semiconductor chip package structure for achieving electrical connection without using wire-bonding process includes an insulative substrate unit, a package unit, a semiconductor chip, a first conductive unit, an insulative unit and a second conductive unit. The package unit is disposed on the insulative substrate unit to form a receiving groove. The semiconductor chip is received in the receiving groove. The semiconductor chip has a plurality of conductive pads. The first conductive unit has a plurality of first conductive layers formed on the package body, and one side of each first conductive layer is electrically connected to each conductive pad. The insulative unit has an insulative layer formed between the first conductive layers in order to insulate the first conductive layers from each other. The second conductive unit has a plurality of second conductive layers respectively formed on another sides of the first conductive layers.
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