BEAM PROCESSING APPARATUS, BEAM PROCESSING METHOD, AND BEAM PROCESSED SUBSTRATE
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United States of America Patent
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Issued Date -
Jan 27, 2011
app pub date -
Mar 19, 2009
filing date -
Mar 24, 2008
priority date (Note) -
Abandoned
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Abstract
A beam processing apparatus is provided in which a beam is irradiated to a layer 3 to be processed which is formed on one surface of a substrate 2, thereby to process the layer. The apparatus has a gas floating mechanism 10 that supports the substrate in flatly-floated state by ejecting gas, and a beam irradiation unit 50 that irradiates a beam to the layer 3 which is formed on one surface of the substrate 2, thereby to process the layer 3. The substrate 2 is arranged on the gas floating mechanism 10 with one surface of the substrate 2 on which the layer 3 is formed being directed downwards. Then, processing is applied to the layer 3 by irradiating a beam on the layer 3 through the substrate 2 by means of the beam irradiation unit 50 from above the other surface of the substrate 2.
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