DIPPING SOLUTION FOR USE IN PRODUCTION OF SILICEOUS FILM AND PROCESS FOR PRODUCING SILICEOUS FILM USING THE DIPPING SOLUTION
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United States of America Patent
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Issued Date -
Jan 20, 2011
app pub date -
Mar 3, 2009
filing date -
Mar 6, 2008
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Abandoned
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Abstract
This invention relates to a dipping solution used in a process for producing a siliceous film. The present invention provides a dipping solution and a siliceous film-production process employing the solution. The dipping solution enables to form a homogeneous siliceous film even in concave portions of a substrate having concave portions and convex portions. The substrate is coated with a polysilazane composition, and then dipped in the solution before fire. The dipping solution comprises hydrogen peroxide, a foam-deposit inhibitor, and a solvent.
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