SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
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United States of America Patent
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Issued Date -
Jan 20, 2011
app pub date -
Jul 9, 2010
filing date -
Jul 14, 2009
priority date (Note) -
Abandoned
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Abstract
According to one embodiment, a semiconductor device includes a base substrate, at least one semiconductor chip provided above the base substrate, and a resin case covering the semiconductor chip and supported by the base substrate. A partition plate holds back extension of a crack occurring in the resin case being provided in the resin case.
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