SYSTEMS AND METHODS FOR REAL-TIME MONITORING OF DIE USE OR YIELD
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United States of America Patent
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app pub date -
Mar 2, 2009
filing date -
Feb 28, 2008
priority date (Note) -
Abandoned
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Abstract
A method for monitoring die cutting comprising the steps of placing at least one cutting die on a hide, each cutting die having a particular pattern and an RFID (Radio Frequency Identification) tag coupled thereto, each RFID tag containing die-related information about that particular cutting die, repeatedly reading at least one RFID tag to obtain the die-related information for each RFID tag in real-time, based on the die-related information, determining whether the hide is ready for cutting, generating an output based on with whether the hide is ready for cutting, and when the hide is ready for cutting, cutting the hide.
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