Imide Oligomer And Polyimide Resin Obtained By Thermal Curing Thereof
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United States of America Patent
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Issued Date -
Jan 6, 2011
app pub date -
Jul 28, 2008
filing date -
Feb 7, 2008
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Abstract
To provide an imide oligomer, excellent in thermal moldability, having excellent heat resistance as a thermally-cured polyimide resin, and that is obtainable easily and inexpensively. An imide oligomer including a nonaxisymmetric site derived from one nonaxisymmetric aromatic diamine molecule represented by below formula (1), only at a central portion of the oligomer chain,—.
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