Importance

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Abstract

To provide a semiconductor chip whose number of electrodes are minimized while the horizontal position between the semiconductor chip and the mounted substrate is maintained in implementation to avoid any connection problem, as well as to prevent the damage to the semiconductor circuit of such chip.For example, there is a cross-shaped connection bump disposition area which is formed by memory banks which face with each other with a certain distance. And in the area in the cross-shaped connection bump disposition area, signal input output connection bumps (the first electrodes) are disposed and form a group. On the other hand, by disposing a group of power/grounding connection bumps in the area which crosses in the right angle with the area where a group of the signal input output connection bumps is disposed, forming a group, the memory chip is supported by the power/grounding bumps (via soldering) so that it will not tilt when implemented on the wiring chip, thus, its horizontal position is maintained by the minimum number of bumps. For example, the memory chip is composed as such.

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First Claim