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United States of America Patent
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Issued Date -
Dec 30, 2010
app pub date -
Jun 30, 2009
filing date -
Jun 30, 2009
priority date (Note) -
Abandoned
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Abstract
A protective structure is provided on a substrate to which a semiconductor die is attached. The protective structure surrounds the die and reduces the thermo-mechanical stresses to which the die is subject. The die is protected against cracking, warping, and delamination.
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