Rolled copper foil
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United States of America Patent
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Issued Date -
Dec 23, 2010
app pub date -
Oct 13, 2009
filing date -
Jun 22, 2009
priority date (Note) -
Abandoned
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Abstract
A rolled copper foil includes copper (Cu), an inevitable impurity, a first additive element that forms a solid solution in the copper, and a second additive element that is different from the first additive element, is contained in the copper, and forms a compound with the inevitable impurity.
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