DEPOSITION APPARATUS AND DEPOSITION METHOD

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United States of America Patent

APP PUB NO 20100323108A1
SERIAL NO

12864904

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Abstract

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A disclosed deposition apparatus includes a catalyst reaction apparatus including an introduction part that introduces a first source gas, a catalyst container that contains a catalyst that produces reactive gas from the first source gas introduced from the introduction part, and a reactive gas ejection part that ejects the reactive gas from the catalyst container; a reactive gas separator that allows the reactive gas ejected from the reactive gas ejection part to go therethrough; a substrate supporting part that supports a substrate; and a supplying part that supplies a second source gas that reacts with the reactive gas that passes through the reactive gas separator, thereby depositing a film on the substrate.

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Patent Owner(s)

Patent OwnerAddress
TOKYO ELECTRON LIMITEDTOKYO JAPAN
NATIONAL UNIVERSITY CORPORATION NAGAOKA UNIVERSITY OF TECHNOLOGYNAGAOKA-SHI NIIGATA 940-2188

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Inoue, Yasunobu Niigata, JP 64 135
Miura, Hitoshi Niigata, JP 27 696
Nishiyama, Hiroshi Niigata, JP 80 716
Yasui, Kanji Niigata, JP 5 12

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