SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Dec 23, 2010
app pub date -
Sep 27, 2007
filing date -
Dec 29, 2006
priority date (Note) -
Abandoned
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Abstract
A semiconductor device in which overall thickness is reduced by suppressing the rising of a metal thin line and connection reliability is enhanced at the joint of metal thin line and other member during resin sealing. A method for manufacturing such semiconductor device is also provided. The semiconductor device (10A) comprises electrodes (12A, 12B, 12C), a semiconductor chip (13) bonded to the upper surface of the electrode (12A) formed in the shape of island, a metal thin line (15A) connecting the semiconductor chip (13) and the electrode (12C), a metal thin line (15B) connecting the semiconductor chip (13) and the electrode (12B), and a sealing resin (11) supporting those elements mechanically by sealing them integrally. The metal thin lines (15A, 15B) have planar shape curved convexly toward the upstream of the flow if the sealing resin (11) to be injected.
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