LIGHT EMITTING DIODE PACKAGING STRUCTURE
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United States of America Patent
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Issued Date -
Dec 23, 2010
app pub date -
Dec 4, 2009
filing date -
Jun 23, 2009
priority date (Note) -
Abandoned
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Abstract
A light emitting diode (LED) packaging structure includes a base, a transparent layer, and an LED chip. The transparent layer is provided between the LED chip and the base to increase a relative distance between the LED chip and the base. With an increased relative distance between the LED chip and the base and the light transmitting function of the transparent layer, the overall LED packaging structure can have enhanced light extraction efficiency. Further, the transparent layer provides good thermal conductivity and accordingly, forms no harm to the heat dissipation efficiency of the LED.
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