METHOD FOR MAKING CAMERA MODULES AND CAMERA MODULE MADE THEREBY
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United States of America Patent
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app pub date -
Aug 11, 2010
filing date -
Jul 10, 2008
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Abandoned
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Abstract
A method for making camera modules includes the steps of: a) providing a wafer including an array of sensor chips; b) mounting a plurality of lens assemblies on the sensor chips, respectively, thereby defining a plurality of intersecting spacing grooves among the lens assemblies; c) forming a substrate layer by filling in the spacing grooves with a resin material; and d) cutting the wafer and the substrate layer along intersecting cutting lines each extending along one of the spacing grooves and each intervening the lens assemblies, the substrate layer being divided into a plurality of barrels respectively surrounding the lens assemblies. A camera module made by the method is also disclosed.
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