LOW DISTORTION PACKAGE FOR A MEMS DEVICE INCLUDING MEMORY
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United States of America Patent
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Issued Date -
Dec 16, 2010
app pub date -
Aug 14, 2008
filing date -
Aug 14, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A package to receive a memory device including an electromagnetic motor comprises a body having a top surface and a bottom surface. Conductive leads extend through the body so that the conductive leads are at least partially exposed within the package. A base is connectable with the bottom surface of the body, and a lid is connectable with the top surface of the body. The base and the lid have substantially matched thermal expansion characteristics and provide magnetic flux return paths for the electromagnetic motor.
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