Patterning a thick film paste in surface features
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United States of America Patent
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Oct 30, 2012
Grant Date -
Dec 16, 2010
app pub date -
Dec 19, 2008
filing date -
Dec 21, 2007
priority date (Note) -
Expired
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Abstract
This invention relates to a method for the fabrication of electrical and electronic devices using a photoresist deposited in pre-existing through holes in a device structure and a thick film paste, and to the devices made by such method. The method allows thick film paste deposits in the corners of the holes. This invention also relates to devices made with thick film pastes that are patterned using a diffusion layer made from residual photoresist deposits in a hole.
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