AU ALLOY WIRE FOR BALL BONDING
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United States of America Patent
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Issued Date -
Dec 16, 2010
app pub date -
Oct 15, 2008
filing date -
Nov 6, 2007
priority date (Note) -
Abandoned
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Abstract
[Issues to be Solved] To provide Au alloy wire for ball bonding, which is superior in wire strength, and also is superior in formability of molten ball and roundness of compressed ball. Moreover it is superior at stitch bondability, and is available for high density wiring of semiconductor devices.[Solution Means] An Au alloy wire for ball bonding comprising: 15-50 wt ppm Mg, 10-30 wt ppm Ca, 5-20 wt ppm Eu, 5-20 wt ppm Y, 5-20 wt ppm La and residual Au is 99.998 wt % purity or higher, moreover, purity of more than 99.98 wt % Au. The mass of additive Ca is less than the value of total amount of additive Eu and additive La, and the mass of additive Y is less than the value of the total amount of additive Ca and additive Eu, and the mass of Mg is 20-40 wt ppm.
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