SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING APPARATUS
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United States of America Patent
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Issued Date -
Dec 16, 2010
app pub date -
Aug 21, 2009
filing date -
Sep 25, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The substrate cleaning method of and the substrate cleaning apparatus for removing contaminants such as particles adhering to a surface of a substrate attain a high throughput and effectively remove the particles and the like. To clean the back surface Wb of the substrate W, DIW cooled down to a temperature near its freezing point and cooling gas which is at a lower temperature than the freezing point of the DIW are discharged toward the center of the lower surface of the substrate which rotates. When thus cooled DIW flows along the back surface Wb of the substrate W, the particles and the like adhering to the substrate are removed.
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