ELECTRIC CIRCUIT BOARD COMPOSITION AND A METHOD OF PREPARING CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Dec 9, 2010
app pub date -
Jun 8, 2009
filing date -
Jun 8, 2009
priority date (Note) -
Abandoned
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Abstract
, the electric circuit board composition with excellent properties can be obtained. This epoxy resin composition in this invention can achieve the peeling strength>10 lbf/inch, glass transition temperature>155, water absorption<0.2, outstanding heat resistance and pass the UL94 V-0 flame resistance test. That can be applied to high performance electronic materials widely.
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