STRUCTURED LAYER DEPOSITION ON PROCESSED WAFERS USED IN MICROSYSTEM TECHNOLOGY
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United States of America Patent
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Issued Date -
Dec 9, 2010
app pub date -
Jun 16, 2008
filing date -
Jun 14, 2007
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Abandoned
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Abstract
The invention relates to a method and a through-vapor mask for depositing layers in a structured manner by means of a specially designed coating mask which has structures that accurately fit into complementary alignment structures of the microsystem wafer to be coated in a structured manner such that the mask and the wafer can be accurately aligned relative to one another. Very precisely defined portions on the microsystem wafer are coated through holes in the coating mask, e.g. by mans of sputtering, CVD, or to evaporation processes.
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