Positive resist compositions and patterning process
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United States of America Patent
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Dec 30, 2014
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app pub date -
Jun 3, 2010
filing date -
Jun 4, 2009
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Abstract
A positive resist composition comprises (A) a resin component which becomes soluble in an alkaline developer under the action of an acid and (B) an acid generator. Resin component (A) is a polymer comprising recurring units of formula (1) wherein R1 is H, CH2 or CF3, R2 is an acid labile group, R3 is H or CO2CH3, X is O, S, CH2 or CH2CH2, 0.01≦a<1 and 0.01≦b<1. When processed by ArF lithography, the composition forms a pattern with a satisfactory mask fidelity and a minimal LWR.
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