UNIFIED SCALABLE HIGH SPEED INTERCONNECTS TECHNOLOGIES
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United States of America Patent
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Issued Date -
Dec 9, 2010
app pub date -
Jun 3, 2009
filing date -
Jun 3, 2009
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Abstract
Traditional High Speed Electronic Systems Interconnect experience several bandwidth bottlenecks along the multiplicity of signal paths that limits the information throughput. Here we build upon the cellular interconnect concept of PMTL, the Periodic Micro Transmission Line which was introduced in an earlier patent application, and provide a new type of transmission line VMPL, as the Vertical Micro Transmission Line approach to make all the elements of a high speed interconnect wideband, unified, scalable, and practical for high volume manufacturing. This provides total connectivity improvements from end-to-end of electronic systems that demands higher bandwidth, and increased information throughput, thermal management, and impeccable signal integrity. The technologies introduced here provide solutions for any level of the fan out from chips to systems, in CMOS, or Packages, and PCB's.
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