LID FOR A FUNCTIONAL PART AND A PROCESS FOR ITS MANUFACTURE
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United States of America Patent
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app pub date -
Sep 3, 2007
filing date -
Sep 1, 2006
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Abstract
intermetallic compounds, and lead-free solder on the plated surface. The intermetallic compounds are bonded to the difficult to solder material and the intermetallic compounds are connected to each other, so the solder layer functions as a high-temperature solder. The problem of poor solderability of high-temperature solders is avoided by the present invention.
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