COPPER PLATE BONDING FOR HIGH PERFORMANCE SEMICONDUCTOR PACKAGING
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United States of America Patent
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May 13, 2010
filing date -
May 14, 2009
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Abstract
A bonding plate forms high-performance, low-resistance interconnections between integrated circuit die and an electronic package lead frame. The bonding plate is made from copper, aluminum, or metalized silicon and is processed using standard semiconductor fabrication techniques to apply solder bumps and, optionally, copper pillars. The bonding plates are singulated from a wafer and applied to the die package using standard pick-and-place and solder reflow equipment and processes. This achieves high performance interconnect at low cost without the need for specialized tooling.
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