VIBRATION CUTTING DEVICE AND METHOD FOR VIBRATION CUTTING
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United States of America Patent
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Issued Date -
Nov 18, 2010
app pub date -
Nov 27, 2008
filing date -
Nov 29, 2007
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Abandoned
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Abstract
The present invention discloses a vibration cutting device and a method for vibration cutting. The vibration cutting device comprises at least one first oscillating heat, a controller, by means of which the first oscillating head can be selectively electrically excited in order to carry out oscillations within a frequency range below the kilohertz range, and a cutting tool disposed between a first and a second fixture, while the first fixture is connected to the first oscillating head such that mechanical oscillations of the first oscillating head can be transferred to the cutting tool.
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