UNDER-CHIN HEADPHONE SET
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United States of America Patent
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Issued Date -
Nov 11, 2010
app pub date -
Oct 17, 2008
filing date -
Oct 17, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
There is provided an under-chin band headphone set comprising two earpiece bands (OB) and two earplugs (OS) which are respectively secured to an ear-side end (OB1) of the two earpiece bands (OB). A respective ball joint (K) is provided at the ear-side end (OB1) of the earpiece bands (OB) in such a way that a first end of the ball joint (K) is arranged movably at the ear-side end (OB1) of the earpiece band (OB) and the second end of the ball joint (K) serves to receive the earplugs (OS).
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