Solar Cell Interconnection on a Flexible Substrate
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United States of America Patent
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Issued Date -
Nov 11, 2010
app pub date -
May 6, 2009
filing date -
May 6, 2009
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Abandoned
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Abstract
A solar cell array comprising: a substrate having a carrier surface on which a plurality of electrically conductive bonding pads are provided, the bonding pads being spaced from one another along a main direction; a plurality of solar cells, each solar cell of the plurality including a back electrode bonded to a first portion of a respective bonding pad, wherein each bonding pad comprises a second portion defining an exposed contact region not covered by the back electrode of the respective solar cell, and wherein an interconnecting lead electrically connects the second portion of the bonding pad associated with a first solar cell with an electrode of a directly adjacent second solar cell.The substrate is an electrically insulating substrate and preferably a flexible film, made for instance of polyimide material.
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