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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
ABACUS FINANCE GROUP LLC	6 EAST 43RD STREET 20TH FLOOR NEW YORK NY 10017-6994

International Classification(s)

• H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Russell, James V	Whitehouse Station, US	29	116
# of filed Patents : 29 Total Citations : 116

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Patent Citation Ranking

• 1 Citation Count
• H05K Class

• 1.76 % this patent is cited more than
• 15 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent Application No: 2010/0276,188

Method and apparatus for improving power gain and loss for interconect configurations

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Abstract

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The present disclosure relates to embedding a power modification component such as a capacitance or a resistance inside of pads that are located to extend over and beyond the vias of the PCB so that a portion of the pad containing the embedded capacitance or resistance is located beyond where the vias or blinds are located. Each of the pads will include an opening that is located over a given one of the vias or blinds to permit that via to conduct through the opening. In this way the capacitance and the resistance will have a closer contact point the electrical component.

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Description

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Claims

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