SOLDER BALL PRINTING APPARATUS AND SOLDER BALL PRINTING METHOD
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United States of America Patent
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app pub date -
Apr 22, 2010
filing date -
Apr 23, 2009
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Abstract
The present invention provides a solder ball printing apparatus and a solder ball printing method in which solder balls are uniformly dispersed on a mask surface and are loaded into an opening area of the mask.A solder ball shaking and discharging unit includes a solder ball feeding unit which receives solder balls from a solder ball reservoir unit, a wire member in a convex shape which is attached so as to surround a solder ball shaking and discharging port of the solder ball feeding unit and in which a plurality of wire members are arranged at predetermined intervals, and solder ball loading members, each of which is arranged in the front and rear of the wire member in a convex shape to load the solder balls into an opening area of a mask.
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