LIQUID ELECTRICAL INTERCONNECT AND DEVICES USING SAME
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United States of America Patent
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Apr 24, 2009
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Apr 24, 2009
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Abstract
Various embodiments include interconnects for semiconductor structures that can include a first conductive structure, a second conductive structure and a non-hardening liquid conductive material in contact with the first and second structure. Other embodiments include semiconductor components and imager devices using the interconnects. Further embodiments include methods of forming a semiconductor structure and focusing methods for an imager device.
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