Pb-FREE COPPER ALLOY SLIDING MATERIAL
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United States of America Patent
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Issued Date -
Oct 21, 2010
app pub date -
Aug 2, 2007
filing date -
Aug 5, 2006
priority date (Note) -
Abandoned
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Abstract
When a Cu—Sn—Bi had-particle based sliding material is used for sliding, Cu of Cu matrix flows and covers up Bi phase. Seizure resistance lowers as time passes. A Pb-free sliding material preventing the reduction of seizure resistance is provided. (1) Composition: from 1 to 15% of Sn, from 1 to 15% of Bi, from 0.02 to 0.2% of P, and from 1 to 10% of hard particles having an average diameter of from 50 to 70 μm, with the balance being Cu and unavoidable impurities. (2) Structure: Bi phase and the hard particles are dispersed in the copper matrix, and all of said hard particles are bonded to the copper matrix.
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