Preparing Method for Printed Circuit Boards by Directing Printing and Printed Circuit Boards Prepared by the Method

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United States of America Patent

APP PUB NO 20100263917A1
SERIAL NO

12630580

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method of preparing printed circuit boards (PCB) or flexible printed circuit boards (FPCB) by direct printing includes: 1) a step of printing a pattern on substrate with a paste composition including conductive particles, polyamic acid as binder and solvent; 2) a step of baking the printed substrate to imidize the polyamic acid; and 3) a step of electro-plating the printed substrate. Printed circuit boards (PCB) or flexible printed circuit boards (FPCB) are produced by applying an addition method of direct printing while to simplify processes, to save time and cost, and to minimize waste.

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Patent Owner(s)

Patent OwnerAddress
EXAX INCGUMI-SI KYUNGSANGBUK-DO 730-906

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Heo, Soon Yeong Cheonan-si, KR 8 45
Park, Seong Sil Cheonan-si, KR 5 28

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