HEAT MANAGEMENT FOR ENCLOSED ELECTRONICS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Oct 21, 2010
app pub date -
Apr 21, 2009
filing date -
Apr 21, 2009
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
Providing a plurality of fans within an enclosure. A system implementing this technique can include an enclosure, a heat sink in thermal communication with the enclosure, electronic components at least partially sealed within the enclosure, an eXclusive OR (XOR) fan array, a monitoring engine, and a control engine. A method implementing this technique can include using a heat sink to dissipate heat generated by electronic components within an enclosure; determining that each of the fans of a XOR fan array are stopped, selecting one and only one of the fans of the XOR fan array for operation, and operating the fan to increase air flow within the enclosure, thereby increasing the efficiency of the heat sink.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully