Methods of Patterning Substrates Using Microcontact Printed Polymer Resists and Articles Prepared Therefrom

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United States of America Patent

APP PUB NO 20100252955A1
SERIAL NO

12752540

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention is directed to methods for patterning substrates using contact printing to form patterns comprising a polymer, using the patterns formed therefrom as resists, and process products formed by the process.

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Patent Owner(s)

Patent OwnerAddress
MERCK PATENT GESELLSCHAFTMIT BESCHRAENKTER HAFTUNG DARMSTADT 64271

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AGARWAL, Sandip Somerville, US 23 670
Kügler, Ralf Cambridge, US 4 14
Kursawe, Monika Seeheim-Jugenheim, DE 13 264
Mayers, Brian T Arlington, US 22 703
McLellan, Joseph M Quincy, US 19 733

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