AMBIENT-CURABLE ANISOTROPIC CONDUCTIVE ADHESIVE
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United States of America Patent
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Issued Date -
Oct 7, 2010
app pub date -
Apr 7, 2009
filing date -
Apr 7, 2009
priority date (Note) -
Abandoned
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Abstract
Compositions of ambient-curable anisotropic conductive adhesive comprising an ambient-curable epoxy resin system and a conductive powder are proposed. It can be cured under ambient conditions using common magnet for clamping mechanism. This greatly simplifies many electronic repairs or Do-It-Yourself types of application. This anisotropic conductive adhesive can also be applied using traditional hot-bar laminator, but at lowered temperatures, and this is bound to open up new application possibilities.
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