SYSTEM AND METHOD FOR REDUCING OBJECT DEFORMATION DURING A PULSED HEATING PROCESS
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United States of America Patent
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Issued Date -
Oct 7, 2010
app pub date -
Jun 21, 2010
filing date -
Jun 1, 2005
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Abandoned
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Abstract
An approach for optimizing the thermal budget during a pulsed heating process is disclosed. A heat sink or thermal transfer plate is configured and positioned near an object, such as a semiconductor wafer, undergoing thermal treatment. The heat sink is configured to enhance the thermal transfer rate from the object so that the object is rapidly brought down from the peak temperature after an energy pulse. High thermally-conductive material may be positioned between the plate and the object. The plate may include protrusions, ribs, holes, recesses, and other discontinuities to enhance heat transfer and avoid physical damage to the object during the thermal cycle. Additionally, the optical properties of the plate may be selected to allow for temperature measurements via energy measurements from the plate, or to provide for a different thermal response to the energy pulse. The plate may also allow for pre-heating or active cooling of the wafer.
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