Methodology for creating layered panel structure including self-bonded thermoformable and non-thermoformable layer materials
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Jun 11, 2010
filing date -
Aug 2, 2006
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method of forming a layered, generally planar panel structure including the steps of (a) utilizing applied heat and pressure, causing a melt of resin present in a thermoformable material layer to flow toward and into an adjacent non-thermoformable material layer, and (b) by such utilizing and causing, forming a thermal-compression, mechanical, inter-material-transition bond between the layers.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully