THERMOELECTRIC MODULE

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United States of America Patent

APP PUB NO 20100252084A1
SERIAL NO

12743699

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Thermoelectric elements are arranged with a high density in a peripheral region surrounding a center region or in an outer circumferential region of an opposing surface of a substrate instead of being arranged in the center region of the opposing surface. As compared to the case when the thermoelectric elements are arranged in the center of the opposing surface, when the thermoelectric elements are arranged in the region excluding the center region of the opposing surface, the thermoelectric element serving as a reference point of warp is positioned at an outer circumference side, i.e., the distance between the warp reference point and the outer circumference of the substrate becomes shorter. As the distance between the warp reference point and the outer circumference of the substrate becomes shorter, the displacement amount and the force of the warp caused at the outer circumference of the substrate become smaller. Moreover, when the thermoelectric elements are arranged with a high density, the force of each of the thermoelectric elements pulled by the substrate warp becomes smaller. Thus, by reducing the displacement amount and the force of the warp generated at the outer circumference of the substrate, it is possible to prevent a damage of the thermoelectric elements caused by the substrate warp.

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Patent Owner(s)

Patent OwnerAddress
KELK LTDKANAGAWA COUNTY JAPAN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Konishi, Akio Kanagawa, JP 126 662

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