THERMAL INSULATION STRUCTURE
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Sep 30, 2010
app pub date -
Mar 26, 2009
filing date -
Mar 26, 2009
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A thermal insulation structure is disposed on an outer surface of a housing of an electronic device. The thermal insulation structure includes a plurality of tubular structures arranged in parallel, and each of the tubular structures extends along an extension direction. Each tubular structure has at least one tube wall enclosing to form a hollow space. Due to the tubular structures, the thermal isolation structure has anisotropic thermal conductivity. In the thermal isolation structure, heat transfer in every direction is different, and the hot spot area is relative enlarged to reduce the highest temperature on the surface of the thermal isolation structure. Thus, high temperature hot spot area caused by the heat generating element is prevented to be formed on the surface of the electronic device.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully