Liquid resin composition for underfill, flip-chip mounted body and method for manufacturing the same

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United States of America Patent

SERIAL NO

12798142

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Abstract

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The invention relates to a liquid resin composition for underfill comprising (A) an epoxy resin, (B) an amine-based curing agent, and (C) an inorganic filler, a viscosity at a temperature of 25° C. being 1 to 150 Pa·s, and a time required for the viscosity to become 1 Pa·s at a temperature of 100° C. being 40 to 180 minutes.

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Patent Owner(s)

Patent OwnerAddress
NAMICS CORPORATIONNIIGATA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hasegawa, Masahiro Niigata-shi, JP 158 1182
Hoshiyama, Masaaki Niigata-shi, JP 8 10

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