Liquid resin composition for underfill, flip-chip mounted body and method for manufacturing the same
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app pub date -
Mar 30, 2010
filing date -
Mar 31, 2009
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Abstract
The invention relates to a liquid resin composition for underfill comprising (A) an epoxy resin, (B) an amine-based curing agent, and (C) an inorganic filler, a viscosity at a temperature of 25° C. being 1 to 150 Pa·s, and a time required for the viscosity to become 1 Pa·s at a temperature of 100° C. being 40 to 180 minutes.
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