Method For Applying A Thin-Film Encapsulation Layer Assembly To An Organic Device, And An Organic Device Provided With A Thin-Film Encapsulation Layer Assembly Preferably Applied With Such A Method
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United States of America Patent
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Issued Date -
Sep 30, 2010
app pub date -
May 16, 2008
filing date -
May 16, 2007
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Abandoned
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Abstract
A method for applying a thin-film encapsulation layer assembly to an organic device, which comprises a substrate which is provided with an active stack and is then provided with the thin-film encapsulation layer assembly for screening the active stack substantially from oxygen and moisture, wherein the thin-film encapsulation layer assembly is formed by applying at least one organic and at least one inorganic layer applied with PECVD or reactive sputtering, onto the active stack, wherein after application of a first organic layer a metal layer is applied to the first organic layer before an inorganic layer is applied thereto utilizing PECVD or reactive sputtering, wherein the metal layer is applied utilizing a deposition technique that causes relatively little radiation, wherein the metal layer protects the organic layer against radiation upon a subsequent PECVD or reactive sputtering process step for applying an inorganic layer. The invention also relates to an organic device manufactured with such a method.
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