SOLDERING FLUX, SOLDER PASTE COMPOSITION AND SOLDERING METHOD
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United States of America Patent
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Issued Date -
Sep 30, 2010
app pub date -
Nov 25, 2008
filing date -
Nov 27, 2007
priority date (Note) -
Abandoned
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Abstract
Provided is a soldering flux in which the volatilized amount in reflowing is reduced to enable soldering with a small environmental load while suppressing the stickiness of the flux residue to ensure a high reliability, as well as a solder paste composition and a soldering method using the same. The soldering flux comprises a base resin, an activating agent, and a solvent, wherein the solvent comprises an organic acid anhydride being liquid form at 20.degree. C. or higher and a polyhydric alcohol being liquid form at 20.degree. C. or higher, and when the acid value and the content of the organic acid anhydride is AV (mgKOH/g) and W.sub.A(g), respectively, and the hydroxyl value and the content of the polyhydric alcohol is OHV (mgKOH/g) and W.sub.OH(g), respectively, then AV.times.W.sub.A:OHV.times.W.sub.OH=1:0.4 to 0.6.
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