SPUTTERING TARGET AND METHOD FOR PREPARATION THEREOF
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United States of America Patent
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app pub date -
Jun 11, 2010
filing date -
Apr 3, 2003
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Abandoned
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Abstract
A sputtering target prepared by the butt joining of metal sheets being made of the same material, wherein an intermetallic compound in a joined portion has an average particle diameter of 60% to 130% of the average particle diameter of the intermetallic compound in a non-joined portion is provided. In the sputtering target, the average particle diameter of an intermetallic compound in a joined portion is approximately the same as that of the intermetallic compound in a non-joined portion.
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