HEAT PIPE TYPE HEAT TRANSFER DEVICE
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United States of America Patent
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Issued Date -
Sep 30, 2010
app pub date -
Aug 21, 2007
filing date -
Aug 24, 2006
priority date (Note) -
Abandoned
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Abstract
An object of the present invention is to provide a heat transfer device succeeded in satisfying both the reduction in size and weight and the high heat transfer performance by incorporating an organic fine particle into a working fluid and optimizing its size, mixing ratio, composition, surface properties and the like.The heat transfer device of the present invention is a heat pipe type heat transfer device comprising a closed container having housed therein a working fluid containing from 0.001 to 5 wt % of an organic fine particle having an average particle diameter of 1 to 1,000 nm.
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