Method of Chemical Mechanical Polishing

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20100240283A1
SERIAL NO

12567092

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Abstract

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[Problem] To improve polishing efficiency while lowering shear force added to semiconductor wafers while increasing polishing speed, without damaging the wafer's processing surface or the membrane under it.is ideal conditions.

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Patent Owner(s)

Patent OwnerAddress
ARACA INC2550 EAST RIVER ROAD APT 12204 TUCSON AS 85718
TOKYO ELECTRON INCAKASAKA BIZ TOWER AKASAKA 5-3-1 MINATO-KU TOKYO
TOHOKU NATIONAL UNIVERSITY OF KATAHIRA2-1-1 SENDAI-SHI MIYAGI-KEN

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gu, Xun Sendai-shi, JP 20 59
Nemoto, Takenao Tokyo, JP 15 86
Ohmi, Tadahiro Sendai-shi, JP 798 14083
Philipossian, Ara Tucson, US 36 607
Sampurno, Yasa Tucson, US 13 54
Teramoto, Akinobu Sendai-shi, JP 114 811

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