LIGHT EMITTING DIODE PACKAGE STRUCTURE AND FABRICATION THEREOF
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United States of America Patent
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Issued Date -
Sep 23, 2010
app pub date -
Mar 19, 2009
filing date -
Mar 19, 2009
priority date (Note) -
Abandoned
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Abstract
An ultraviolet light emitting diode package structure is disclosed, comprising a substrate with a through-silicon via (TSV) disposed therein, a first electrode disposed on a top side of the substrate, and a second electrode disposed on a bottom side of the substrate, wherein the first electrode and the second electrode are electrically connected through the TSV, an ultraviolet light emitting diode bonded to the top side of the substrate, and a cover substrate bonded to the substrate, wherein the cover substrate comprises a cavity for receiving the ultraviolet light emitting diode.
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